Page 7 - Combined_133_OCR

ON THE AGENDA OF THE 6TH INTERNATIONAL ELECTRONIC

nay be raised to ^chanisms by which lift is generated upon a
i may be added dy in proximity to the ground, one involv-
layer,
ssed for reduc-
body have been
oviding a less
air between the
Similar results
restricting the

lat is uniformly
ries only as the
ze, but the net AT WORK IN ELECTRON
ders also is af-
between them
le spoiler or re- MECHANICAL DESIGN CONCEPT FOR A HIGH ENERGY
* pressure exist- ’
LIFT ON 2.5:1 ELLIPTICAL
cylinder is free WATER COOLED LASER
CYLINDER NEAR A SURFACE
ader and since LASER WELDING AND ELECTRONIC CIRCUIT FABRICATION
itive lift of the
here the separ- g flow between the body and the surface and LASER WELDING AS AN ELECTRONIC JOINING TECHNIQU
)oiler is loca^ i e in which no flow passes beneath the body
pressure e J ut in which the pressures beneath the body PRACTICAL APPLICATIONS OF LASER WELDING
the body. ' I nust be considered. The lift coefficients are
tion of the .based upon the vertically projected area of the THE AFFECT OF LASERS ON ELECTRONIC PACKAGING IS
s no flow
(Cylinder. As more and more of the cylinder is ONE SESSION TO BE PRESENTED AT THE SIXTH INTERN!
brought into contact with the ground, the im­
portance of the location of the spoilers beneat h ELECTRONIC CIRCUIT PACKAGING SYMPOSIUM AT THE
the body increases. A spoiler located at the rear HILTON HOTEL, SAN FRANCISCO, AUGUST 23rd and 24th,
greatly increases the lift, while a spoiler at the CONCURRENT WITH WESCON
to nt can produce negative lift.
Since raising the body increases instability
because of the higher center of gravity, the OTHER SESSIONS WILL INCLUDE:
setter course for very-high-speed vehicles PACKAGING FOR HIGH SPEED ELECTRONIC SYSTE
yould be toward low clearances and rear-
MICROELECTRONIC PACKAGING TECHNIQUES
/entilated undersurfaces, since they would be
operating on relatively smooth surfaces. PACKAGING MICROELECTRONIC SYSTEMS

—____________ INTERCONNECTION TECHNOLOGY
120 V
jrees -<=>
TION ON ». Hoerner, S. F.; “Fluid-Dynamic Drag”; published by the FOR REGISTRATION INFORMATION, WRITE:
fLINDER
luthor; 1958. INTERNATIONAL ELECTRONIC CIRCUIT PACKAGING SYMI
URFACE
?. Cornish, J. J.; “An Analysis of the Airflow around the MG A POST OFFICE BOX 155 ENGLEWOOD, COLORADO
Roadster”; Aerophysics Research Note No. 19, Mississippi State
■Univ.; October 1963. SPONSORED BY
flow, the pi CONCURRENT WITF
3. Cornish, J. J., and Fortson, C. B.; “Aerodynamic Drag Char­
lation pre?
acteristics oj Forty-Eight Automobiles”; Aerophysics Research
zlinder. W Note No. 23, Mississippi State Univ.; June 1964.
tion occu 4. White, Joseph F.; “New Techniques for Full-Scale Testing”;
ir is lower paper presented at SAE National Automobile Week Meeting,
Detroit; 1960.
his lower
,5. Schlichting, H.; “Aerodynamic Problems of Motor Cars”;
ces the n A.G.A.R.D. Report 307; 1960.
□rward. 1
*r, the n
' the moi
Abstracted from a paper presented to the International Automotive
Engineering Congress, Detroit, Mich., Jan. 11-15, 1965. SAE
? two sej
Paper 948B.

GN N
19 6 5